Singapore's STATS ChipPAC Ltd. has enlarged its entrenched wafer-level ball grid array (eWLB) technology to recomposed 300-mm wafers.
Through a formerly-declared coalition with its technology associates in 2008, Infineon Technologies AG and STMicroelectronics, STATS ChipPAC jointly developed eWLB and is the first in the semiconductor industry to make eWLB technology, like side-by-side devices entrenched in a package, ultra thin eWLB package and two metal layer redistribution.
STATS ChipPAC has invested over $100 million in eWLB technology. It is dispatching over 30,000 reconstituted wafers per quarter and is on road to accomplish yields of 99% and above by the end of 2010.
The eWLB technology has already been verified and accepted by many major mobile cellphone companies to meet the demand for intricate and power efficient semiconductor gadgets.
Using a blend of conventional front-end and back-end semiconductor manufacturing methods, eWLB technology decreases manufacturing costs while offering a smaller package footprint with higher input/output (I/O) together with enhanced thermal and electrical performance. At STATS ChipPAC, improvement work continues on the eWLB evolution to facilitate bigger package sizes, higher Input/Output (I/O) density and 3D package-on-package (PoP) solutions to address a broader application market.
STATS ChipPAC recently said that profit for fourth quarter of 2009 rose by 21.6% over the corresponding quarter a year back and by 1.3% over preceding quarter to $394.7 million. Returns for the year 2009, of $1.325.7 billion declined by 20.0% over past year.
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